US 2017/0325370 A1Published application

Component mounter

AssigneeFuji Machine Mfg. Co., Ltd.

InventorMizuho NOZAWA

Life of this patent

Estimating the term…

Loading patent…

Abstract

A component mounter for holding a component and for mounting the component on a surface of a board includes a head, a horizontal moving device, a vertical moving device, a mounting control device, and an imaging device. The imaging device is configured to image an imaging target by receiving incident light from the imaging target on an imaging element via an optical system. The optical system includes a first optical system configured to guide incident light from a direction of a side surface of a nozzle tip to a first region of the imaging element, and a second optical system configured to guide incident light from a direction of the surface of the board to a second region of the imaging element. The imaging device is configured to image an image via the first optical system and the second optical system.

Claims8

Dependent claims

A component mounter configured to hold a component and mount the component on a surface of a board, the component mounter comprising:
a head having a nozzle configured to hold the component at a nozzle tip of the nozzle;
a horizontal moving device configured to move the head in a horizontal direction with respect to the surface of the board;
a vertical moving device configured to move the nozzle in a vertical direction with respect to the surface of the board;
a mounting control device configured to perform mounting operation of mounting the component held by the nozzle at a mounting location on the surface of the board by moving the head using the horizontal moving device such that the nozzle is positioned above the mounting position on the surface of the board and lowering the nozzle using the vertical moving device;
and
an imaging device provided on the head and configured to image an imaging target by receiving incident light from the imaging target on an imaging element via an optical system,
wherein
the optical system includes
a first optical system configured to guide incident light from a direction of a side surface of the nozzle tip to a first region of the imaging element, and
a second optical system configured to guide incident light from a direction of the surface of the board to a second region of the imaging element in a state with the nozzle above the surface of the board, and
the imaging device is configured to be able to image an image of the side surface of the nozzle tip and an image of the surface of the board respectively via the first optical system and the second optical system.

9 more elements

Facts

Application: 15/534,552Filed 10 Dec 2014
Published: 9 Nov 2017
Term ends: Not estimatedThe source records don’t support an estimate.

Classification4 codes

H05K 13/0413
Pick-and-place heads or apparatus, e.g. with jaws: with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g.…
H05K 13/0812
Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling…
H05K 13/0813
Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling…
H05K
Printed circuits

Family

US 10,925,199 B2Related patent
US 2017/0325370 A1This patent

From the US filing history. Foreign family members aren’t listed.

Timeline

Citations

Open elsewhere

Building an agent or pulling many patents? Use the API or MCP server instead of scraping pages. Get an API key