Back to results
US 2017/0290205 A1Published application
Immersion cooling systems and methods
AssigneeHamilton Sundstrand Corporation
InventorsCharles Shepard, Kris H. Campbell
Life of this patent
Estimating the term…
Abstract
An electronics cooling arrangement includes a housing, an electronic device disposed within the housing, and a solid-liquid phase change material disposed within the housing and is in thermal communication with the electronic device to absorb heat generated by the electronic device. A method of cooling an electronic device and a vehicular electronics cooling system are also described.
Claims20
An electronics cooling arrangement, comprising:
- a housing;
- an electronic device disposed within the housing;
- and
- a solid-liquid phase change material (PCM) disposed within the housing and in thermal communication with the electronic device, wherein the solid-liquid PCM is configured to absorb heat generated by the electronic device.
1 more element
An electronics cooling arrangement for a vehicular electrical system, comprising:
- a sealed housing;
- a liquid-vapor phase dielectric coolant contained within the housing;
- an electronic device submerged within the dielectric coolant, the electronic device having a conductor in direct contact with the dielectric coolant;
- and
- a solid-liquid phase change material (PCM) contained within the housing, wherein the solid-liquid PCM is free-floating within the dielectric coolant, and wherein the solid-liquid phase coolant is in thermal communication with the electronic device through the liquid-vapor phase coolant.
2 more elements
A method of cooling an electronic device, comprising:
- transferring heat from the electronic device to a fluid;
- and
- transferring heat from the fluid to a solid-liquid phase change material (PCM).
Dependencies are inferred from the claim text.