Extended temperature operation for electronic systems using induction heating
AssigneeIntel Corporation
InventorsPrakriti CHOUDHARY, Arnab CHOUDHURY
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Abstract
Embodiments are generally directed to extended temperature operation for electronic systems using induction heating. An embodiment of an apparatus includes an electronic device including: a die or package; a thermal solution coupled with the die or package for cooling of the die or package; and ferromagnetic material, wherein the ferromagnetic material is to generate induction heating of the die or package in response to an alternating magnetic field.
Claims20
An apparatus comprising:
- an electronic device including:
- a die or package,
- a thermal solution coupled with the die or package for cooling of the die or package, and
- ferromagnetic material;
- wherein the ferromagnetic material is to generate induction heating of the die or package in response to an alternating magnetic field.
A system comprising:
- an electronic device including:
- a die or package,
- a heatsink coupled with the die or package for cooling of the die or package, and
- ferromagnetic material;
- and
- induction coils around the electronic device at least in part;
- wherein the ferromagnetic material is to generate induction heating of the die or package in response to an alternating magnetic field generated by the induction coils.
A non-transitory computer-readable storage medium having stored thereon data representing sequences of instructions that, when executed by a processor, cause the processor to perform operations comprising:
- initializing a system including an electronic device, the electronic device including ferromagnetic material for induction heating;
- receiving a temperature signal;
- upon determining based on the temperature signal that a temperature is below a threshold temperature, enabling the induction heating of the electronic device;
- and
- upon determining based on the temperature signal that a temperature is above the threshold temperature, disabling the induction heating of the electronic device.
Dependencies are inferred from the claim text.