Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold

A pattern forming method, comprising in this order:

• a first laying step (1) of laying a layer formed of a curable composition (A1) containing at least a component (a1) serving as a polymerizable compound and a component (d1) serving as a solvent on a surface of a substrate;
• a second laying step (2) of dispensing droplets of a curable composition (A2) containing at least a component (a2) serving as a polymerizable compound dropwise discretely onto the layer formed of the curable composition (A1) to lay the droplets;
• a mold contacting step (3) of sandwiching a mixture layer obtained by partially mixing the curable composition (A1) and the curable composition (A2) between a mold having a pattern and the substrate;
• a light irradiating step (4) of irradiating the mixture layer with light from the side of the mold to cure the layer;
• and
• a releasing step (5) of releasing the mold from the mixture layer after the curing,
• a content ratio of the component (d1) serving as a solvent in the curable composition (A1) being 90 wt % or more,
• a content ratio of the component (d1) serving as a solvent in the curable composition (A1) when the second laying step (2) is performed being 10 wt % or less,
• a surface tension of the component (d1) serving as a solvent being lower than a surface tension of a composition of the components of the curable composition (A1) except the component (d1) serving as a solvent.