Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold

A pattern forming method, comprising in this order:

• a first laying step (1) of laying a layer formed of a curable composition (A1) containing at least a component (a1) serving as a polymerizable compound and a component (b1) serving as a photopolymerization initiator on a surface of a substrate;
• a second laying step (2) of dispensing droplets of a curable composition (A2) containing at least a component (a2) serving as a polymerizable compound and a component (b2) serving as a photopolymerization initiator dropwise discretely onto the layer formed of the curable composition (A1);
• a mold contacting step (3) of sandwiching a mixture layer obtained by partially mixing the curable composition (A1) and the curable composition (A2) between a mold and the substrate;
• a light irradiating step (4) of irradiating the mixture layer with light from the side of the mold to cure the layer;
• and
• a releasing step (5) of releasing the mold from the mixture layer after the curing,
• wherein, the curable composition (A1) being laid also around a region where the mold and the mixture layer are brought into contact with each other,
• a content of the component (b1) serving as the photopolymerization initiator of the curable composition (A1) being 0 parts by weight or more and less than 0.1 part by weight with respect to 100 parts by weight of the component (a1) serving as the polymerizable compound,
• the light irradiated in the light irradiating step (4) does not include a light having a wavelength of 350 nm or less.

An imprint pretreatment coating material which forms a liquid film as pretreatment coating on a substrate and promotes spreading of components of liquid droplets in the plane of the substrate when the liquid droplets are dispensed onto the liquid film,

• wherein
• the imprint pretreatment coating material contains at least a component (a1) serving as a polymerizable compound and a component (b1) serving as the photopolymerization initiator,
• the blending ratio of the component (b1) serving as a photopolymerization is 0 weight part or more and less than 0.1 weight parts with respect to 100 weight parts of the component (a1) serving as a polymerizable compound, and
• the polymerization conversion degree of the component (a1) serving as the polymerizable compound is 50% or less at a time of exposure under the condition having illuminance of 1.00 mW/cm2 and exposure time of 100.0 seconds.