US 2017/0283250 A1 · MULTI-PRESSURE MEMS PACKAGE

Abstract

The present disclosure relates to a microelectromechanical systems (MEMS) package having two MEMS devices with different pressures, and an associated method of formation. In some embodiments, the (MEMS) package includes a device substrate and a cap substrate bonded together. The device substrate includes a first trench and a second trench. A first MEMS device is disposed over the first trench and a second MEMS device is disposed over the second trench. A first stopper is raised from a first trench bottom surface of the first trench but below a top surface of the device substrate and a second stopper is raised from a second trench bottom surface of the second trench but below the top surface of the device substrate. A first depth of the first trench is greater than a second depth of the second trench.

Claims20

Dependent claims

A microelectromechanical systems (MEMS) package comprising:

a device substrate comprising a first trench and a second trench;
a first MEMS device disposed over the first trench and a second MEMS device disposed over the second trench;
and
a cap substrate bonded to the device substrate, enclosing a first cavity over the first MEMS device and a second cavity over the second MEMS device;
wherein a first stopper is raised from a first trench bottom surface of the first trench but below a top surface of the device substrate and a second stopper is raised from a second trench bottom surface of the second trench but below the top surface of the device substrate;
wherein a first depth of the first trench is greater than a second depth of the second trench.

3 more elements

Dependencies are inferred from the claim text.

Multi-pressure mems package

Life of this patent

Multi-pressure mems package

Life of this patent

Abstract

Claims20