Thermal conducting structure applied to network control automation system

A thermal conducting structure applied to a network control automation system, comprising a circuit module and a heat dissipation structure,

• said circuit module comprising a circuit board disposed uprightly and at least one heat source disposed on a surface of said circuit board, and said circuit board defining bare copper regions disposed at top and bottom side ends thereof, and copper foil layers respectively disposed on said bare copper regions on left and right side surfaces of an end of said circuit board in a horizontal direction and configured for conducting a heat generated during operation of said at least one heat source, wherein the circuit board comprises a plurality of ports at a front part thereof, and an insertion part disposed along a vertical direction at a rear end thereof.;
• said heat dissipation structure comprising an outer shell member which has opposite side panels respectively disposed at top and bottom lateral sides thereof, and each of said side panels defining a track member which has a sliding edge and a sliding slot formed inside said sliding edge in the horizontal direction to mount and abut with said copper foil layer for completing assembly of said heat dissipation structure and said circuit module, and forming thermal conducting path, wherein an accommodation open chamber through front-to-rear is formed between said outer shell member and said two side panels thereof, so that said circuit board is horizontally movable to be positioned inside said accommodation open chamber.