Magnetoresistive memory device and manufacturing method of the same
AssigneeKabushiki Kaisha Toshiba
InventorTomoya SANUKI
Life of this patent
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Abstract
According to one embodiment, a magnetoresistive memory device, includes first wirings arranged parallel to each other in or on a substrate, second wirings arranged parallel to each other above the substrate to cross the first wirings when viewed in a direction perpendicular to a surface of the substrate, and magnetoresistive elements provided corresponding to intersections of the first and second wirings, respectively, and divided into layers.
Claims16
A magnetoresistive memory device, comprising:
- first wirings arranged parallel to each other in or on a substrate;
- second wirings arranged parallel to each other above the substrate to cross the first wirings when viewed in a direction perpendicular to a surface of the substrate;
- and
- magnetoresistive elements provided corresponding to intersections of the first and second wirings, respectively, and divided into layers.
A magnetoresistive memory device, comprising:
- a substrate comprising word lines arranged parallel to each other and select transistors using the word lines as gates electrodes;
- bottom contacts provided on the substrate and connected to part of the select transistors, respectively;
- magnetoresistive elements provided on the bottom contacts, respectively;
- top contacts provided on the magnetoresistive elements, respectively;
- an interlayer insulating film provided to cover sides of the magnetoresistive elements, the top contacts and the bottom contacts;
- and
- bit lines provided on the interlayer insulating film, each connecting several of the top contacts, arranged parallel to each other and crossing the word lines when viewed in a direction perpendicular to a surface of the substrate,
- wherein the magnetoresistive elements are classified into groups, and
- the groups are provided in different layers.
A manufacturing method of a magnetoresistive memory device, the method comprising:
- forming a first interlayer insulating film on a substrate comprising first wirings arranged parallel to each other;
- burying first electrodes in the first interlayer insulating film;
- forming a first group of magnetoresistive elements on the first electrodes;
- forming a second interlayer insulating film on the first group of magnetoresistive elements and the first interlayer insulating film;
- burying second electrodes in the first and second interlayer insulating films;
- and
- forming a second group of magnetoresistive elements on the second electrodes.
Dependencies are inferred from the claim text.