US 2017/0250123 A1Published application

Method and Apparatus for Cooling Integrated Circuits

AssigneeKeysight Technologies, Inc.

InventorsTodd M. Bandhauer, Torben P. Grumstrup, David R. Hobby

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Abstract

An apparatus having first, second, and third chambers and a plurality of receiving channels is disclosed. The first chamber includes a device surface to be cooled. The second chamber has a first surface positioned opposite to the device surface to be cooled, the first surface including a plurality of jet openings adapted to spray a coolant on the device surface when the second chamber is pressured with the coolant. The third chamber is adapted to receive coolant that left the first chamber. Each of the receiving channels has a first end in the first chamber and a second end in the third chamber. Each of the receiving channels is adjacent to a corresponding one of the jet openings and is positioned to remove coolant dispersed into the first chamber by that jet opening.

Claims12

Dependent claims

An apparatus comprising:

a first chamber comprising a device surface to be cooled;
a second chamber having a first surface positioned opposite to said device surface to be cooled, said first surface comprising a plurality of jet openings adapted to spray a coolant on said device surface when said second chamber is pressured with said coolant;
a third chamber adapted to receive coolant that left said first chamber;
and
a plurality of receiving channels, each of said plurality of receiving channels having a first end in said first chamber and a second end in said third chamber, each of said plurality of receiving channels being adjacent to a corresponding one of said plurality of jet openings and being positioned to remove coolant dispersed into said first chamber by that jet opening, wherein said coolant does not change phase on contact with said device surface.

2 more elements

Dependencies are inferred from the claim text.