Substrate treatment apparatus and substrate treatment method
AssigneeKabushiki Kaisha Toshiba
InventorsTomohiko SUGITA, Katsuhiro SATO, Hiroyasu llMORI, Yoshihiro OGAWA
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AssigneeKabushiki Kaisha Toshiba
InventorsTomohiko SUGITA, Katsuhiro SATO, Hiroyasu llMORI, Yoshihiro OGAWA
Estimating the term…
In one embodiment, a substrate treatment method includes cleaning and rinsing a surface of a substrate provided with a pattern, and supplying a solidifying agent containing liquid that contains a solidifying agent to the cleaned and rinsed surface of the substrate. The method further includes precipitating the solidifying agent as solid on the surface of the substrate, and decomposing and gasifying the solid to remove the solid from the surface of the substrate. Furthermore the solidifying agent contains an ammonium salt, and the ammonium salt contains an ammonium ion or an ion having a structure in which at least one of four hydrogen atoms of an ammonium ion is substituted with another atom or an atom group.
A substrate treatment method comprising:
A substrate treatment apparatus comprising:
Dependencies are inferred from the claim text.