Copper etching method for manufacturing circuit board

A copper etching method for manufacturing a circuit board, comprising:

• electroplating a metal copper support layer on a base layer;
• coating a thermal sensitive photo resist layer on the metal copper support layer;
• coating a photo resist layer on the thermal sensitive photo resist layer, performing a process of pattern transfer, removing part of the photo resist layer, and exposing the corresponding part of the thermal sensitive photo resist layer to form a photo resist pattern;
• electroplating a metal copper layer to cover the exposed thermal sensitive photo resist layer to form a circuit pattern;
• peeling off the photo resist layer, and pressing a stacked body composed of a stacked substrate and a stacked material layer onto the circuit pattern such that the circuit pattern is embedded in the stacked material layer;
• removing the base layer;
• performing a copper etching process to etch and remove the metal copper support layer to expose the thermal sensitive photo resist layer;
• and
• removing the thermal sensitive photo resist layer to expose the circuit pattern protruding from a surface of the stacked material layer.