Semiconductor device and method for manufacturing the same
AssigneeKabushiki Kaisha Toshiba
InventorsKotaro FUJII, Hideaki AOCHI
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AssigneeKabushiki Kaisha Toshiba
InventorsKotaro FUJII, Hideaki AOCHI
Estimating the term…
According to one embodiment, the semiconductor film includes a first semiconductor part, a second semiconductor part, and a third semiconductor part. The first semiconductor part extends in the stacked body in a stacking direction of the stacked body. The second semiconductor part extends in the stacked body in the stacking direction and a first direction crossing the stacking direction. The third semiconductor part extends in the underlayer in a second direction connecting the first semiconductor part and the second semiconductor part. The first semiconductor part, the second semiconductor part and the third semiconductor part are made of a same material and are continuous with each other. The first metal layer is in contact with a side surface of the second semiconductor part.
A semiconductor device comprising:
A method for manufacturing a semiconductor device, comprising:
Dependencies are inferred from the claim text.