US 2016/0254176 A1 · Positive Pressure Bernoulli Wand with Coiled Path

Abstract

A wand operating under the Bernoulli principle to pick up, transport and deposit wafers, which continuous pattern imposed into the horizontal surface of the single piece paddle, a variety of openings oriented within the continuous pattern and passing through the horizontal surface of the single piece paddle, a channel with walls having a variety of openings spaced apart from one another and passing through the walls of channel, which may be fit into the continuous pattern and the openings in the walls of channel aligning to some of the variety of openings oriented within the continuous pattern.

Claims20

Dependent claims

A wand comprising:

a top plate;
a bottom plate with an underside;
a plurality of gas orifices disposed in the bottom-plate underside with a diameter of 0.1-2.0 hundredths of an inch penetrating the bottom plate;
and
a curved channel associated with the bottom plate and having a path.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

15/055,607Filed 28 Feb 2016

Priority

27 Feb 2015

Published

1 Sep 2016

Term ends

Not estimatedThe source records don’t support an estimate.

Classification5 codes

H10P 72/78
For supporting or gripping: using vacuum or suction, e.g. Bernoulli chucks
B25J 11/0095
Manipulators not otherwise provided for: manipulators transporting wafers
B25J 15/0683
With vacuum: details of suction cup structure, e.g. grooves or ridges
H10P
Generic processes or apparatus for the manufacture or treatment of devices covered

Positive Pressure Bernoulli Wand with Coiled Path

Life of this patent

Positive Pressure Bernoulli Wand with Coiled Path

Life of this patent

Abstract

Claims20