Nonvolatile semiconductor memory device and method of manufacturing the same
AssigneeKabushiki Kaisha Toshiba
InventorsTakeshi SONEHARA, Takahiro HIRAI, Masaaki HIGUCHI, Takashi SHIMIZU
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AssigneeKabushiki Kaisha Toshiba
InventorsTakeshi SONEHARA, Takahiro HIRAI, Masaaki HIGUCHI, Takashi SHIMIZU
Estimating the term…
According to an embodiment, a nonvolatile semiconductor memory device comprises a plurality of conductive layers that are stacked in plurality in a first direction via an inter-layer insulating layer, that extend in a second direction which intersects the first direction, and that are disposed in plurality in a third direction which intersects the first direction and the second direction. In addition, the same nonvolatile semiconductor memory device comprises: a semiconductor layer that has the first direction as a longitudinal direction; a tunnel insulating layer that contacts a side surface of the semiconductor layer; a charge accumulation layer that contacts a side surface of the tunnel insulating layer; and a block insulating layer that contacts a side surface of the charge accumulation layer. Furthermore, in the same nonvolatile semiconductor memory device, an end in the third direction of the plurality of conductive layers is rounded.
A nonvolatile semiconductor memory device, comprising:
A method of manufacturing a nonvolatile semiconductor memory device, comprising:
A method of manufacturing a nonvolatile semiconductor memory device, comprising:
Dependencies are inferred from the claim text.