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US 2015/0147883 A1Published application
Post-CMP Cleaning and Apparatus for Performing the Same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorHui-Chi Huang
Life of this patent
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Abstract
A method of performing a post Chemical Mechanical Polish (CMP) cleaning includes picking up the wafer, spinning a cleaning solution contained in a cleaning tank, and submerging the wafer into the cleaning solution, with the cleaning solution being spun when the wafer is in the cleaning solution. After the submerging the wafer into the cleaning solution, the wafer is retrieved out of the cleaning solution.
Claims20
A method comprising:
- picking up a wafer;
- spinning a cleaning solution contained in a cleaning tank;
- submerging the wafer into the cleaning solution, with the cleaning solution spun when the wafer is in the cleaning solution;
- and
- after the submerging the wafer into the cleaning solution, retrieving the wafer out of the cleaning solution.
2 more elements
A method comprising:
- performing a Chemical Mechanic Polish (CMP) to planarize a front surface of a wafer;
- rotating a cleaning tank, wherein a cleaning solution is contained in the cleaning tank, and wherein the cleaning solution spins along with the cleaning tank;
- cleaning the wafer by submerging the wafer into the cleaning solution, wherein the front surface of the wafer faces a bottom of the cleaning tank, and wherein the cleaning tank spins when the wafer is in the cleaning solution;
- and
- after the submerging the wafer into the cleaning solution, retrieving the wafer out of the cleaning solution.
2 more elements
An apparatus comprising:
- a cleaning tank configured to hold liquid, wherein the cleaning tank is configured to rotate;
- and
- a vacuum head facing toward the cleaning tank, wherein the vacuum head is configured to move between a first position and a second position, wherein at the first position, a wafer picked up by the vacuum head is fully out of a solution in the cleaning tank, and at the second position, the wafer is fully submerged in the solution.
Dependencies are inferred from the claim text.