Power semiconductor device and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsDong Soo SEO, In Hyuk SONG, Jae Hoon PARK, Kee Ju UM, Chang Su JANG
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AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsDong Soo SEO, In Hyuk SONG, Jae Hoon PARK, Kee Ju UM, Chang Su JANG
Estimating the term…
A power semiconductor device may include: a first semiconductor region having a first conductivity type; a second semiconductor region having a second conductivity type and formed on the first semiconductor region; a third semiconductor region having the first conductivity type and formed in an upper portion of the second semiconductor region; a trench gate formed to penetrate from the third semiconductor region to the first semiconductor region, having a gate insulating layer formed on a surface thereof, and filled with a conductive material; and a fourth semiconductor region having the second conductivity type and formed to penetrate through the second semiconductor region.
A power semiconductor device, comprising:
A method of manufacturing a power semiconductor device, the method comprising:
Dependencies are inferred from the claim text.