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US 2015/0144159 A1Published application
Mechanisms for wafer cleaning
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShang-Yuan YU, Shao-Yen KU, Chien-Wen HSIAO, Hong-Jie XU, Jui-Chuan CHANG, Wen-Chang TSAI
Life of this patent
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Abstract
Embodiments that relate to mechanisms for cleaning wafers is provided. A method for wafer cleaning includes cleaning wafers by a wet-bench cleaning operation. The method also includes thereafter cleaning each of the wafers by a single-wafer cleaning operation. In addition, a cleaning apparatus for enhancing the performance of the above method is also provided.
Claims22
1-8. (canceled)
An apparatus for wafer cleaning, comprising:
- a chamber;
- a wet-bench cleaning device within the chamber, wherein the wet-bench cleaning device comprises a lifter associated with a tank;
- and
- a plurality of single-wafer cleaning devices within the chamber and adjacent to the wet-bench cleaning device, wherein the wet-bench cleaning device is between the single-wafer cleaning devices, and each of the single-wafer cleaning devices comprises a dispenser over a wafer-positioning element.
1 more element
16-20. (canceled)
Dependencies are inferred from the claim text.