Semiconductor structure
AssigneeChipbond Technology Corporation
InventorsChin-Tang Hsieh, You-Ming Hsu, Ming-Sheng Liu, Chih-Ping Wang
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AssigneeChipbond Technology Corporation
InventorsChin-Tang Hsieh, You-Ming Hsu, Ming-Sheng Liu, Chih-Ping Wang
Estimating the term…
A semiconductor structure includes a carrier, a first protective layer, a second protective layer, and a third protective layer. A first surface of the first protective layer comprises a first anti-stress zone. The second protective layer reveals the first anti-stress zone and comprises a second surface, a first lateral side, a second lateral side and a first connection side. The second surface comprises a second anti-stress zone. An extension line of the first lateral side intersects with an extension line of the second lateral side to form a first intersection point. A zone formed by connecting the first intersection point and two points of the first connection side is the first anti-stress zone. The third protective layer reveals the second anti-stress zone and comprises a second connection side projected on the first surface to form a projection line parallel to the first connection side.
A semiconductor structure having at least one corner includes:
Dependencies are inferred from the claim text.