Chemical Fluid Processing Apparatus and Chemical Fluid Processing Method
AssigneeTokyo Electron Limited
InventorsDerek W Bassett, Wallace P Printz, Gentaro Goshi, Hisashi Kawano, Yoshihiro Kai
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AssigneeTokyo Electron Limited
InventorsDerek W Bassett, Wallace P Printz, Gentaro Goshi, Hisashi Kawano, Yoshihiro Kai
Estimating the term…
A chemical fluid processing apparatus and a chemical fluid processing method are described, to treat a substrate with a plurality of chemical fluids such that substantially constant temperature is maintained across a substrate surface. The apparatus includes a discharge nozzle above the substrate to supply a first chemical fluid at a first temperature to a front surface of the substrate, a bar nozzle oriented in a radial direction of the substrate to supply a second chemical fluid at a second temperature to the front surface or a back surface of the substrate, the second temperature being higher than the first temperature, and where the bar nozzle includes a plurality of outlets for discharging the second chemical fluid to a plurality of contacting places on the front surface or the back surface of the substrate at different distances from the center of the substrate.
A chemical fluid processing apparatus to treat a substrate with a plurality of chemical fluids such that substantially constant temperature is maintained across a substrate surface, the apparatus comprising:
A chemical fluid processing method to treat a substrate with a plurality of chemical fluids such that substantially constant temperature is maintained across a substrate surface, the method comprising:
Dependencies are inferred from the claim text.