Wafer alignment and bonding tool for 3d integration

A method of bonding a first semiconductor structure located within a first bonding chuck to a second semiconductor structure located within a second bonding chuck, the method comprising:

• positioning the first bonding chuck relative to the second bonding chuck such that a first and a second alignment marker associated with the first semiconductor structure are substantially facing a third and a fourth alignment marker associated with the second semiconductor structure;
• de-aligning the third alignment marker with respect to the first alignment marker using a first infrared microscope, the first infrared microscope receiving infrared light from the first and third alignment marker via an opening in the second bonding chuck;
• de-aligning the fourth alignment marker with respect to the second alignment marker by a second infrared microscope, the second infrared microscope receiving infrared light from the second and fourth alignment marker via an other opening in the second bonding chuck;
• and
• bonding the first and the second semiconductor structure by mechanical compression of the first and the second semiconductor structure together using the first and the second bonding chuck,
• wherein the de-aligning of the third and the fourth alignment marker is accomplished by applying a temperature to the first chuck.

A bonding chuck apparatus comprising:

• a first bonding chuck that holds a first semiconductor structure;
• a second bonding chuck that holds a second semiconductor structure, the second bonding chuck having a plurality of openings that are transparent to infrared light associated with a plurality of infrared microscopes, wherein the plurality of openings facilitate de-aligning the first and the second semiconductor structures using the plurality of infrared microscopes;
• a force pin coupled to the first bonding chuck, wherein the force pin applies a predetermined force to the first semiconductor structure for bonding to the second semiconductor structure;
• and
• a temperature controller coupled to the second bonding chuck, wherein the temperature controller applies a predetermined temperature to the second semiconductor structure for causing the de-aligning prior to the bonding,
• wherein, upon bonding of the first semiconductor structure to the second semiconductor structure by the force pin, the first and the second semiconductor structure are realigned with respect to each other based on the application of the predetermined temperature prior to the bonding.