Fabricating method of semiconductor device
OwnerByung-Hee Kim, Tae-Soo Kim +3inventors
InventorsBYUNG-HEE KIM, Tae-Soo Kim, Seong-Ho Park, Young-Ju Park, Ju-Young Jung
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OwnerByung-Hee Kim, Tae-Soo Kim +3inventors
InventorsBYUNG-HEE KIM, Tae-Soo Kim, Seong-Ho Park, Young-Ju Park, Ju-Young Jung
Estimating the term…
A semiconductor device is fabricated by forming a lower conductor in a first interlayer dielectric film. A second interlayer dielectric film is formed on the lower conductor and the first interlayer dielectric film. A first hard mask pattern is formed on the second interlayer dielectric film. The first mask pattern has a first opening extending in a first direction. A planarization layer is formed on the first hard mask pattern. A mask pattern is formed on the planarization layer. The mask pattern has a second opening extending in a second direction perpendicular to the first direction. The lower conductor is positioned under an region where the first opening and the second opening overlap. A via hole and a trench connected to the via hole is formed using the first hard mask pattern and the mask pattern. The via hole exposes an upper surface of the lower conductor.
A fabricating method of a semiconductor device comprising:
A fabricating method of a semiconductor device comprising:
A fabricating method of a semiconductor device comprising:
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