Photoresist System and Method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWen-Yun Wang, Cheng-Han Wu
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Abstract
A system and method for photoresists is provided. In an embodiment a photoresist is developed. Once developed, the photoresist is slimmed using either a direct slimming technique or an indirect slimming technique. In a direct slimming technique the slimming agent is either an alkaline solution or a polar solvent. In the indirect slimming technique a hydrophobic material is diffused into the photoresist to form a modified region and the modified region is then removed.
Claims20
A method for manufacturing a semiconductor device, the method comprising:
- developing a photoresist on a substrate;
- and
- reducing a dimension of the photoresist with a chemical after the developing the photoresist.
A method of manufacturing a semiconductor device, the method comprising:
- developing a photoresist on a substrate with a negative tone developer;
- and
- applying a slimming agent to the photoresist after the developing the photoresist.
A method of manufacturing a semiconductor device, the method comprising:
- applying a photoresist to a substrate;
- exposing the photoresist to an energy;
- developing the photoresist with a negative tone developer to form a patterned photoresist with a first width parallel to a major surface of the substrate;
- removing the negative tone developer;
- and
- reducing the first width to a second width after the removing the negative tone developer without removing the entire patterned photoresist.
Dependencies are inferred from the claim text.