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US 2014/0234773 A1Published application
Method of coating resist and resist coating apparatus
AssigneeKabushiki Kaisha Toshiba
InventorsKatsunori SUZUKI, Seiji Nakagawa, Hiroharu Fujise
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Abstract
An aspect of the present embodiment, there is provided a method of coating resist, including providing solvent on a substrate to be processed being set to be nearly still, and rotating the substrate to be processed to provide resist solution on the substrate to be processed from a resist supply nozzle in a state that a top edge of the resist supply nozzle is inserted into the solvent.
Claims14
A method of coating of a resist, comprising:
- providing solvent on a substrate to be processed being set to be nearly still;
- and
- rotating the substrate to be processed to provide resist solution on the substrate to be processed from a resist supply nozzle in a state that a top edge of the resist supply nozzle is inserted into the solvent.
A resist coating apparatus, comprising:
- a substrate holding member configured to nearly horizontally retain the substrate to be processed;
- a rotation unit configured to rotate the substrate holding member;
- a solvent supply nozzle configured to provide solvent to the substrate to be processed;
- a resist solution supply nozzle to be configured to provide resist solution to the substrate to be processed;
- wherein the resist solution is provided on the substrate to be processed from the resist supply nozzle in rotating the substrate to be processed by the rotation unit, in a state that a top edge of the resist solution supply nozzle is inserted into the solvent on the substrate to be processed provided from the solvent supply nozzle.
2 more elements
Dependencies are inferred from the claim text.