Semiconductor manufacturing apparatus and manufacturing method of semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorKoutarou SHO
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Abstract
A semiconductor manufacturing apparatus according to the present embodiment comprises a vacuum chamber. A first stage is configured to temporarily attach a reticle thereonto in order to attract a foreign material present on a back surface of the reticle. A second stage is configured to attach the reticle thereonto after attaching the reticle onto the first stage in order to expose a semiconductor substrate to light using the reticle within the vacuum chamber. An exposure unit is configured to expose a surface of the semiconductor substrate to the light using the reticle attached onto the second stage.
Claims12
A semiconductor manufacturing apparatus comprising:
- a vacuum chamber;
- a first stage temporarily attaching a reticle thereonto in order to attract a foreign material present on a back surface of the reticle;
- a second stage attaching the reticle thereonto, after attaching the reticle onto the first stage, in order to expose a semiconductor substrate to light using the reticle within the vacuum chamber;
- and
- an exposure part exposing a surface of the semiconductor substrate to the light using the reticle attached onto the second stage.
A semiconductor manufacturing apparatus comprising:
- a vacuum chamber;
- a plurality of stages capable of attaching reticles thereonto in order to expose a semiconductor substrate to light using the reticles within the vacuum chamber;
- and
- an exposure part exposing a surface of the semiconductor substrate to the light using the reticles attached onto the stages, respectively, wherein
- the stages are respectively transported to outside of the vacuum chamber while mounting the reticle onto the stages after being used for exposure with the reticles attached onto the stages within the vacuum chamber.
A manufacturing method of a semiconductor device using a semiconductor manufacturing apparatus including a vacuum chamber, a plurality of stages capable of attaching a reticle thereonto, and an exposure part exposing a surface of the semiconductor substrate to light using the reticle, the method comprising:
- removing a foreign material present on a back surface of the reticle by temporarily attaching the reticle onto a first stage among the stages;
- attaching the reticle onto a second stage among the stages after attaching the reticle onto the first stage;
- and
- exposing the surface of the semiconductor substrate to the light using the reticle.
Dependencies are inferred from the claim text.