Semiconductor module cooler and semiconductor module

A semiconductor module for supplying a coolant from an outside to a water jacket included in a cooler and cooling a semiconductor element arranged over an outer surface of the cooler, the semiconductor module comprising:

• a heat sink which is thermally connected to the semiconductor element;
• a first flow path which is placed in the water jacket, which extends from a coolant introduction inlet, and in which a guide portion having an incline for leading the coolant toward one side of the heat sink is placed;
• a second flow path which is placed in the water jacket parallel with and apart from the first flow path, which extends toward a coolant discharge outlet, and which has a sidewall parallel to another side of the heat sink;
• a flow speed adjusting plate which is placed in the second flow path and which is formed apart from and parallel with said another side of the heat sink;
• and
• a third flow path formed in a position in the water jacket in which the first flow path connects with the second flow path,
• wherein:
• the coolant introduction inlet and the coolant discharge outlet are formed in a same wall of the water jacket or at positions on the water jacket diagonally opposite to each other;
• and
• the heat sink is placed in the third flow path.