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US 2014/0193949 A1Published application
Socket type mems bonding
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorTing-Hau Wu
Life of this patent
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Abstract
A method for fabricating an integrated circuit device is disclosed. The method includes providing a first substrate; bonding a second substrate to the first substrate, the second substrate including a microeelectromechanical system (MEMS) device; and bonding a third substrate to the first substrate.
Claims20
A method comprising:
- providing a first substrate;
- bonding a second substrate to the first substrate, the second substrate including a microeelectromechanical system (MEMS) device;
- and
- bonding a third substrate to the first substrate.
1 more element
A method comprising:
- providing a first, second, and third substrate;
- bonding the second substrate to the first substrate;
- patterning the second substrate to form a MEMS device and a cavity extending through the second substrate to expose a portion of the first substrate;
- patterning the third substrate to form a stand-off portion;
- and
- bonding the third substrate to the first substrate by bringing the stand-off portion in contact with the exposed portion of the first substrate through the cavity.
3 more elements
A method comprising:
- providing a first substrate;
- positioning a second substrate over the first substrate, the second substrate being distinct from the first substrate and including a microeelectromechanical system MEMS device and a cavity extending through the second substrate;
- and
- positioning a stand-off portion of a third substrate through the cavity of the second substrate,
- wherein an open space separates the cavity of the second substrate from the stand-off portion of the third substrate.
2 more elements
Dependencies are inferred from the claim text.