Bonding transistor wafer to led wafer to form active led modules

A method of forming a lighting device comprising:

• forming a first array of vertical light emitting diodes (LEDs) in an LED wafer, each of the LEDs having a top LED conducting surface and a bottom LED conducting surface;
• and
• forming a second array of vertical transistors in a transistor wafer, each of the transistors having a first terminal, a second terminal, and a third terminal, the first terminal being a bottom conducting surface of the transistors;
• aligning the LED wafer with the transistor wafer such that each transistor area in the transistor wafer is aligned with each LED area in the LED wafer;
• forming bonded wafers by bonding the top LED conducting surface of the LED wafer to the bottom conducting surface of the transistor wafer to electrically and mechanically bond the top LED conducting surface to the bottom conducting surface by a bonding layer;
• and
• singulating the bonded wafers to create individual modules, each module containing at least a driver transistor and an LED.