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AssigneesNational Institute of Advanced Industrial Science and Technology, Fujikoshi Machinery Corp.
InventorsYoshio NAKAMURA, Daizo ICHIKAWA, Haruo SUMIZAWA, Shiro HARA, Sommawan KHUMPUANG, Shinichi IKEDA
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A method of manufacturing semiconductor wafers is provided which facilitates formation of orientation flat lines and allows beveling work without problems. The method of manufacturing semiconductor wafers according to the present invention is a method of manufacturing semiconductor wafers, in which a plurality of small-diameter wafers is cut out from a large-diameter semiconductor wafer, the method including: a marking step of forming straight groove-like orientation flat lines by a laser beam so as to cross the respective small-diameter wafers in each row in the large-diameter semiconductor wafer, wherein cutout positions of the small-diameter wafers are aligned in rows in a specific direction, collectively for each of the rows; and a cutting step of cutting out the small-diameter wafers separately from the large-diameter semiconductor wafer by a laser beam after the marking step.
A method of manufacturing semiconductor wafers, in which a plurality of small-diameter wafers is cut out from a large-diameter semiconductor wafer, the method comprising:
Dependencies are inferred from the claim text.