Back to results
US 2014/0154403 A1Published application
Thin film deposition source, deposition apparatus and deposition method using the same
AssigneeSamsung Display Co., Ltd.
InventorJong Woo Lee
Life of this patent
Estimating the term…
Abstract
A thin film deposition source, a deposition apparatus and a deposition method using the same are disclosed. The deposition apparatus includes a deposition source including a plurality of jet nozzles that spray a deposition substance on a surface of a substrate and are arranged in a first direction, and at least one shutter controlling a jet region of the deposition substance by opening or shielding at least a portion of a jetting passageway of the deposition substance.
Claims14
A thin film deposition method, comprising:
- forming a thin film on a substrate by jetting a deposition substance from a deposition source;
- measuring a thickness of the thin film and comparing the thickness of the thin film with a predetermined thickness;
- and
- when the thickness of the thin film is greater than the predetermined thickness, shielding at least a portion of a jet region of the deposition substance facing the thin film,
- wherein the jet region is between the substrate and the deposition source.
2 more elements
Dependencies are inferred from the claim text.