Facility and method for treating substrate
AssigneeSemes Co., Ltd.
InventorsSoo Min HWANG, Dong Ho KIM, Won Jin KIM, Ho Shin KANG
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Abstract
Provided is a method of a substrate treatment. The method includes providing an operation module with substrates contained in a lot and performing an operation treatment thereon and performing a test treatment on the substrates completed with the operation treatment in a test module. The performing of the test treatment includes determining a substrate to be tested, which is provided to the test module, to allow the test treatment to be completed within an operation treatment time for the substrates in a unit lot.
Claims20
A method of treating a substrate, the method comprising:
- providing an operation module with substrates contained in a lot and performing an operation treatment thereon;
- and
- performing a test treatment on the substrates completed with the operation treatment in a test module,
- wherein the performing of the test treatment comprises determining a substrate to be tested, which is provided to the test module, to allow the test treatment to be completed within an operation treatment time for the substrates in a unit lot.
A substrate treatment facility comprising:
- a load port, on which a lot containing a plurality of substrates is disposed;
- an operation module performing an operation treatment on the substrate;
- an index module located between the load port and the operation module and comprising an index robot transferring the substrate;
- a test module performing a test treatment on a substrate completed with the operation treatment in the operation module;
- and
- a control unit determining a substrate to be tested, which is provided to the test module, to allow the test treatment of the test module to be completed within an operation treatment time for the substrates of the unit lot in the operation module.
Dependencies are inferred from the claim text.