Fin field effect transistors including complimentarily stressed channels
AssigneeInternational Business Machines Corporation
InventorsJosephine B. Chang, Paul Chang, Michael A. Guillorn, Amlan Majumdar
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AssigneeInternational Business Machines Corporation
InventorsJosephine B. Chang, Paul Chang, Michael A. Guillorn, Amlan Majumdar
Estimating the term…
A stressed single crystalline epitaxial semiconductor layer having a first type stress is formed on a single crystalline substrate layer. First and second semiconductor fins are formed by patterning the stressed single crystalline epitaxial semiconductor layer. A center portion of each first semiconductor fin is undercut to form a recessed region, while the bottom surface of each second semiconductor fin maintains epitaxial registry with the single crystalline substrate layer. The center portion of each first semiconductor fin is under a second type of stress, which is the opposite of the first type of stress. A first field effect transistor formed on the first semiconductor fins can include first channels under the second type of stress along direction of current flow, and a second field effect transistor formed on the second semiconductor fins can include second channels under the first type of stress along the direction of current flow.
A method of forming a semiconductor structure comprising:
A semiconductor structure comprising:
Dependencies are inferred from the claim text.