System and method for regulating temperature of electronic component
AssigneeTelefonaktiebolaget L M Ericsson (publ)
InventorYang Zhang
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Abstract
The invention relates to a system for regulating temperature of an electronic component, the system comprising: a local heater for heating the electronic component; a heat pipe for cooling the electronic component; and a heat sink for dissipating heat from the heat pipe; wherein the electronic component is adhered to an end of the heat pipe, and the heat sink is adhered to another end of the heat pipe. The invention also relates to a method for regulating temperature of an electronic component by the system.
Claims28
A system for regulating temperature of an electronic component, the system comprising
- a local heater for heating the electronic component;
- a heat pipe for cooling the electronic component;
- and
- a heat sink for dissipating heat from the heat pipe;
- wherein the electronic component is adhered to an end of the heat pipe, and the heat sink is adhered to another end of the heat pipe.
A method for regulating temperature of an electronic component by a system, wherein the system comprises
- a local heater for heating the electronic component;
- a heat pipe for cooling the electronic component;
- and
- a heat sink for dissipating heat from the heat pipe;
- the method comprising the steps of:
- adhering the electronic component to an end of the heat pipe, and adhering the heat sink to another end of the heat pipe;
- heating the electronic component with the local heater when the ambient temperature is lower than a first predetermined value;
- and
- dissipating heat from the electronic component with the heat pipe when the internal temperature is higher than a second predetermined value.
Dependencies are inferred from the claim text.