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US 2014/0150689 A1Published application
Electroless nickel plating bath composition
AssigneeAtotech Deutschland GmbH
InventorsBoris Alexander JANSSEN, Holger BERA, Sebastian WEISSBROD, Britta SCHAFSTELLER
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Abstract
The present invention relates to an aqueous plating bath composition for depositing a nickel phosphorous alloy having a phosphorous content in the range of 5 to 12 wt. %. The plating bath comprises a sulfur-containing organic stabilizing agent.
Claims9
An aqueous plating bath composition for electroless plating of a nickel phosphorous alloy, the plating bath comprising
- (i) a water soluble source of nickel ions
- (ii) a hypophosphite compound
- (iii) at least one complexing agent selected from the group comprising carboxylic acids, polyamines, sulfonic acids and mixtures thereof and
- (iv) a stabilizing agent selected from the group consisting of compounds according to formulae (1) and (2):
- R1S—(CH2)n—SO3R2 (1)
- R3SO3—(CH2)m—S—S—(CH2)m—SO3R3 (2)
- wherein
- R1, R2 and R3 are independently selected from the group consisting of hydrogen, methyl, ethyl, propyl, butyl, lithium, sodium, potassium and ammonium,
- n ranges from 1 to 6 and
- m ranges from 1 to 6
- and having a pH value in the range of 3.5 to 6.5.
8 more elements
Dependencies are inferred from the claim text.