Connection structure for an integrated circuit with capacitive function
AssigneeSTMicroelectronics S.r.l.
InventorAlberto PAGANI
Life of this patent
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Abstract
An embodiment, in a single structure, combines a pad including a connection terminal suitable for coupling the circuit elements integrated in a chip to circuits outside of the chip itself and at least one capacitor. By combining a connection pad and a capacitor in a single structure, it may be possible to reduce the overall area of the chip that otherwise in common integrated circuits would be greater due to the presence of the capacitor itself. In this way, the costs and size of the chip can be reduced.
Claims31
1-10. (canceled)
A terminal structure, comprising:
- a pad forming an electrode of a first capacitor;
- and
- a first conductor disposed adjacent to the pad and forming another electrode of the capacitor.
An integrated circuit, comprising:
- a first pad forming an electrode of a first capacitor;
- and
- a first conductor disposed adjacent to the pad and forming another electrode of the capacitor.
A system, comprising:
- a first integrated including
- a first pad forming an electrode of a first capacitor;
- and
- a first conductor disposed adjacent to the pad and forming another electrode of the capacitor;
- and
- a second integrated circuit coupled to the first integrated circuit.
A method, comprising propagating a first electrical signal between a pad and a conductor that is capacitively coupled to the pad.
A method, comprising:
- propagating an electrical signal through a conductive pad;
- and
- filtering the electrical signal with a capacitor that has an electrode formed by the pad.
Dependencies are inferred from the claim text.