Heat conduction structure mounted in casing of electronic product

Abstract

A heat conduction structure mounted in a casing of an electronic product includes a main heat conduction module and at least one secondary heat conduction module between a heat source and the casing. The main heat conduction module includes a first heat conduction member located close to the heat source to conduct the heat of the heat source, a first heat resistant member to stop the heat from diffusing, and a heat radiation member contact with the first heat conduction member to radiate the heat. The secondary heat conduction module includes a second heat conduction member parallel to the first heat conduction member, a second heat resistant member between the first heat resistant member and the casing, a first heat radiation member and a second heat radiation member contact with the second heat conduction member to radiate the heat of the second heat conduction member.

Dependencies are inferred from the claim text.