Back to results
US 2013/0270708 A1Published application
Method for forming buried conductive line and structure of buried conductive line
AssigneeNanya Technology Corporation
InventorVivek Gopalan
Life of this patent
Estimating the term…
Abstract
A method for forming a buried conductive line is described. A substrate having a trench therein and a contact area thereon is provided, wherein the trench has an end portion in the contact area and a conductive layer is filled in the trench. A mask layer is formed covering the conductive layer in the contact area. The conductive layer is etched back using the mask layer as a mask.
Claims10
A method for forming a buried conductive line, comprising:
- providing a substrate having a trench therein and a contact area thereon, wherein the trench has an end portion in the contact area, and a conductive layer is filled in the trench;
- forming a mask layer covering the conductive layer in the end portion of the trench;
- and
- etching back the conductive layer using the mask layer as a mask.
1 more element
A structure of a buried conductive line, comprising:
- a substrate, having a trench therein and a contact area thereon, wherein the trench has an end portion in the contact area;
- and
- a conductive layer filled in the trench, wherein a top of the conductive layer in the end portion of the trench is higher than a top of the conductive layer not in the end portion of the trench.
Dependencies are inferred from the claim text.