Thin Film Depositing Apparatus and Thin Film Depositing Method Used by the Same

A thin film depositing method comprising:

• loading a substrate on a mounting plate attached to a transfer shuttle disposed within a deposition chamber, the transfer shuttle being reciprocal with respect to a process gas outlet and having first and second auxiliary plates installed on opposite sides of the mounting plate, the first auxiliary plate being in an unbent state closing the process gas outlet and the second auxiliary plate being in a bent state, when loading the substrate;
• moving the transfer shuttle across the process gas outlet to perform a deposition process;
• unbending the second auxiliary plate when moving the transfer shuttle across the process gas outlet in a first direction and closing the process gas outlet with the second auxiliary plate when the transfer shuttle moves passed the process gas outlet;
• and
• bending the second auxiliary plate when moving the transfer shuttle across the process gas outlet in a second direction opposite the first direction.

A thin film depositing method comprising:

• loading a substrate on a mounting plate attached to a transfer shuttle disposed within a deposition chamber in a loading position, the transfer shuttle being reciprocal with respect to a process gas outlet and having first and second auxiliary plates installed on opposite sides of the mounting plate, the first auxiliary plate being in an unbent state and the second auxiliary plate being in a bent state, when loading the substrate;
• moving the transfer shuttle in a first direction;
• closing the process gas outlet with the first auxiliary plate and unbending the second auxiliary plate, while moving the transfer shuttle in the first direction;
• forming a deposition process on the substrate when the transfer shuttle crosses the process gas outlet while moving in the first direction;
• closing the process gas outlet with the second auxiliary plate when the transfer shuttle passes the process gas outlet in the first direction;
• moving the transfer shuttle in a second direction opposite the first direction;
• forming a deposition process on the substrate when the transfer shuttle crosses the process gas outlet while moving in the second direction;
• and
• closing the process gas outlet with the first auxiliary plate when the transfer shuttle passes the process gas outlet in the second direction.