Manufacturing of dsc type electronic devices by means of spacer insert

A process, comprising:

• placing a circuit assembly in a bottom half of a mold, said bottom half of the mold including a first inner surface and said circuit assembly comprising a first heat sink having a lower surface in contact with the first inner surface, a pin block having a lower surface in contact with the first inner surface, a semiconductor chip in electrical connection with at least the pin block, and a second heat sink in contact with the semiconductor chip;
• placing a spacer insert within an upper half of the mold, said upper half of the mold including a second inner surface and said spacer insert placed in contact with the second inner surface;
• coupling the upper half of the mold to the bottom half of the mold to enclose the circuit assembly with the spacer insert in contact with an upper surface of the second heat sink;
• injecting a cavity formed by the coupled upper half and lower half with an insulating material;
• hardening the insulating material;
• and
• extracting the hardened insulating material encapsulating the circuit assembly from the mold with the lower surface of the first heat sink, the lower surface of the pin block and the upper surface of the second heat sink exposed at an outer surface of the hardened insulating material.

A process, comprising:

• placing a first sheet in a bottom half of a mold, said bottom half of the mold including a first inner surface to which the first sheet is in contact;
• placing a circuit assembly in the bottom half of the mold, said circuit assembly comprising a first heat sink having a lower surface in contact with the first sheet, a pin block having a lower surface in contact with the first sheet, a semiconductor chip in electrical connection with at least the pin block, and a second heat sink in contact with the semiconductor chip;
• placing a spacer insert within an upper half of the mold and in contact with a second inner surface;
• placing a second sheet in the upper half of the mold in contact with the spacer insert;
• coupling the upper half of the mold to the bottom half of the mold to enclose the circuit assembly with the second sheet in contact with an upper surface of the second heat sink;
• injecting a cavity formed by the coupled upper half and lower half with an insulating material;
• hardening the insulating material;
• and
• extracting the hardened insulating material encapsulating the circuit assembly from the mold with the lower surface of the first heat sink, the lower surface of the pin block and the upper surface of the second heat sink exposed at an outer surface of the hardened insulating material.