Semiconductor device and method for making same

A semiconductor circuit pattern, comprising:

• an angled conductive pattern having a line portion and a pad portion at an end of the line portion extending normal to the line portion on a first side of the line portion, the pad portion having a width greater than a width of the line portion;
• a spacing having a first portion adjacent the first side of the pad portion, and a second portion adjacent a second side of the pad portion opposite the first side;
• and
• a second conductive pattern extending around the spacing, the second conductive pattern having a first portion on the first side of the pad portion;
• wherein the pad portion has a height less than 2.3 times a width of the second portion of the spacing, and the first portion of the second conductive pattern has a width greater than 3.7 times the width of the second portion of the spacing.

A method comprising:

• identifying an angled circuit pattern in a layout of a semiconductor integrated circuit, the pattern having:
• a line portion and a pad portion at an end of the line portion extending normal to the line portion on a first side of the line portion, the pad portion having a width greater than a width of the line portion,
• a spacing having a first portion adjacent the first side of the pad portion, and a second portion adjacent a second side of the pad portion opposite the first side, and
• a second conductive pattern extending around the spacing, the second conductive pattern having a first portion on the first side of the pad portion;
• and
• increasing a width of the first portion of the second conductive pattern in the layout if the spacing is an isolated pattern of a type that would be identified by an electronic design automation tool as being a dense pattern.