Heat dissipating device
AssigneeCooler Master Development Corporation
InventorChia-Yu Lin
Life of this patent
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Abstract
A heat dissipating device includes a base and a plurality of heat dissipating fins. The base includes a substrate and a box, wherein the substrate and the box are formed integrally and the box has an accommodating space therein. Each of the heat dissipating fins includes a heat dissipating portion, a fixing portion and an overflow-proof structure. The fixing portion is fixed in the base. The overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the overflow-proof structure is larger than a width of the heat dissipating portion and larger than a width of the fixing portion.
Claims14
A heat dissipating device comprising:
- a base comprising a substrate and a box, the substrate and the box being formed integrally, the box having an accommodating space therein;
- and
- a plurality of heat dissipating fins, each of the heat dissipating fins comprising:
- a heat dissipating portion;
- a fixing portion fixed in the base;
- and
- an overflow-proof structure connected between the heat dissipating portion and the fixing portion;
- wherein a width of the overflow-proof structure is larger than a width of the heat dissipating portion.
Dependencies are inferred from the claim text.