Loading patent…
AssigneesAyumu ADACHI, Koichi NISHIKAWA, Denso Corporation, Central Research Institute of Electric Power Industry, NuFlare Technology, Inc.
InventorsKunihiko SUZUKI, Yuusuke SATO, Hideki ITO, Hidekazu TSUCHIDA, Isaho KAMATA, Masahiko ITO, Masami NAITO, Hiroaki FUJIBAYASHI, Ayumu ADACHI, Koichi NISHIKAWA
Estimating the term…
A film-forming apparatus 100 supplies a plurality of gases toward a substrate 101 in a chamber 103 using a shower plate 124. The shower plate 124 has a plurality of gas flow paths 121 extending within the shower plate along a first face of the substrate 101 side and connected to gas pipes 131 supplying a plurality of gases, and a plurality of gas jetting holes 129 bored such that the plurality of gas flow paths 121 and the chamber 103 communicate with each other on the first face side. In the film-forming apparatus 100, the plurality of gases supplied from the gas pipes 131 to the plurality of gas flow paths 121 of the shower plate 124 are supplied from the gas jetting holes 129 to the substrate 101 without being mixed inside of and vicinity of the shower plate 124.
A film-forming apparatus including a film-forming chamber and a shower plate which is provided at an upper section of the film-forming chamber and through which gases supplied to the film-forming chamber pass, wherein
A film-forming method comprising:
Dependencies are inferred from the claim text.