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US 2013/0093059 A1Published application
Bonded Substrate And Method Of Manufacturing The Same
AssigneeSamsung Corning Precision Materials Co., Ltd.
InventorsJongPil Jeon, Dong-Woon Kim, Donghyun Kim, MinJu Kim, A-Ra Kim, Joong Won Shur, Kyungsub Jung, BongHee Jang
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Abstract
A bonded substrate, the surface roughness of which is reduced, and a method of manufacturing the same. The bonded substrate includes a base substrate and an intermediate layer disposed on the base substrate. The intermediate layer has a greater bubble diffusivity than the base substrate. A thin film layer is bonded onto the intermediate layer, and has a different chemical composition from the base substrate.
Claims14
A bonded substrate comprising:
- a base substrate;
- an intermediate layer disposed on the base substrate, the intermediate layer having a greater bubble diffusivity than the base substrate;
- and
- a thin film layer bonded onto the intermediate layer, the thin film layer having a different chemical composition from the base substrate.
1 more element
A method of manufacturing a bonded substrate comprising:
- preparing a base substrate and a crystalline bulk, the crystalline bulk having a different chemical composition from the base substrate;
- depositing an intermediate layer on the base substrate, the intermediate layer having a greater bubble diffusivity than the base substrate;
- bonding the crystalline bulk onto the intermediate layer while allowing bubbles which are created in a bonding interface between the crystalline bulk and the intermediate layer to be discharged through the intermediate layer;
- and
- dividing the crystalline bulk to leave a thin film layer on the intermediate layer.
2 more elements
Dependencies are inferred from the claim text.