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US 2013/0093033 A9Published application
Three dimensional structures having improved alignments between layers of microcomponents
AssigneeS.O.I.Tec Silicon on Insulator Technologies
InventorsArnaud Castex, Marcel Broekaart
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Abstract
The invention relates to a method of initiating molecular bonding, comprising bringing one face (31) of a first wafer (30) to face one face (21) of a second wafer (20) and initiating a point of contact between the two facing faces. The point of contact is initiated by application to one of the two wafers, for example using a bearing element (51) of a tool (50), of a mechanical pressure in the range 0.1 MPa to 33.3 MPa.
Claims22
A composite three-dimensional structure, comprising:
- a first layer;
- a first plurality of microcomponents formed on a surface of the first layer;
- a second layer having a first surface molecularly bonded to the surface of the first layer on which the first plurality of microcomponents are formed such that the first plurality of microcomponents are buried between the first layer and the second layer;
- and
- a second plurality of microcomponents foamed on an exposed second surface of the first layer, at least some microcomponents of the second plurality of microcomponents corresponding to and generally vertically aligned with at least some microcomponents of the first plurality of microcomponents, wherein offsets between corresponding microcomponents of the first and second pluralities of microcomponents are limited to values less than 200 nm.
2 more elements
A three-dimensionally integrated structure, comprising:
- a first layer;
- a second layer having a first surface bonded to a surface of the first layer by direct inter-atomic forces between the surface of the first layer and the first surface of the second layer;
- a first plurality of microcomponents at a surface of the first layer between the first layer and the second layer;
- and
- a second plurality of microcomponents at an exposed second surface of the first layer, the second plurality of microcomponents aligned with the first plurality of microcomponents, wherein unintended offsets between aligned microcomponents of the first plurality of microcomponents and the second plurality of microcomponents are limited to about 200 nm or less.
2 more elements
Dependencies are inferred from the claim text.