Back to results
US 2013/0075871 A1Published application
Multi-layer chip overlay target and measurement
AssigneeInternational Business Machines Corporation
InventorsChristopher P. Ausschnitt, Nelson M. Felix, Allen H. Gabor
Life of this patent
Estimating the term…
Abstract
A wafer includes an active region and a kerf region surrounding at least a portion of the active region. The wafer also includes a target region having a rectangular shape with a width and length greater than the width, the target region including one or more target patterns, at least one of the target patterns being formed by two sub-patterns disposed at opposing corners of target rectangle disposable within the target region.
Claims4
A wafer comprising:
- an active region;
- a kerf region surrounding at least a portion of the active region;
- a target region having a rectangular shape with a width and a length greater than the width, the target region including one or more target patterns, at least one of the target patterns being formed by two sub-patterns disposed at opposing corners of a target rectangle disposable within the target region.
Dependencies are inferred from the claim text.