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US 2012/0270165 A1Published application
Heating method for maintaining a stable thermal budget
AssigneeInstitute of Microelectronics, Chinese Academy of Sciences
InventorChunlong Li
Life of this patent
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Abstract
The present invention discloses a heating method for maintaining a stable thermal budget. By following the primary procedure with a virtual procedure in such a manner that the total duration of the whole heating process remains constant, it is beneficial to maintain a stable thermal budget and further to maintain a stable device performance.
Claims7
A heating method for maintaining a stable thermal budget, comprising:
- a heating step for increasing the temperature in a reaction furnace from a first temperature to a second temperature;
- a primary procedure step for forming a thin film by treating a wafer, which occupies a first duration T1;
- a virtual process step, which occupies a second duration T2;
- a cooling step for decreasing the temperature in the reaction furnace from the second temperature to the first temperature;
- characterized in that, the sum of said first and second duration is a constant.
2 more elements
Dependencies are inferred from the claim text.