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US 2012/0269967 A1Published application
Hot Wire Atomic Layer Deposition Apparatus And Methods Of Use
AssigneeApplied Materials, Inc.
InventorsJoseph Yudovsky, Garry K. Kwong, Dieter Haas, Steven D. Marcus, Timothy W. Weidman
Life of this patent
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Abstract
Provided are gas distribution plates for atomic layer deposition apparatus including a hot wire or hot wire unit which can be heated to excite gaseous species while processing a substrate. Methods of processing substrates using a hot wire to excite gaseous precursor species are also described.
Claims20
A gas distribution plate, comprising:
- an input face comprising a first precursor gas input configured to receive a flow of a first precursor gas and a second precursor gas input configured to receive a flow of a second precursor gas;
- an output face having a plurality of elongate gas ports configured to direct flows of gases toward a substrate adjacent the output face, the elongate gas ports including at least one first precursor gas port and at least one second precursor gas port, the at least one first precursor gas port in flow communication with the first precursor gas and the at least one second precursor gas port in flow communication with the second precursor gas;
- and
- a wire positioned within at least one of the first precursor gas port and the second precursor gas port, the wire connected to a power source to heat the wire.
1 more element
A method of processing a substrate comprising:
- laterally moving a substrate having a surface beneath a gas distribution plate comprising a plurality of elongate gas ports including at least one first precursor gas port to deliver a first precursor gas and at least one second precursor gas port to deliver a second precursor gas;
- delivering the first precursor gas to the substrate surface;
- delivering the second precursor gas to the substrate surface;
- and
- applying power to a wire positioned within one or more of the at least one first precursor gas port and the at least one second precursor gas port to excite gaseous species in one or more of the first precursor gas and the second precursor gas, the excited species reacting with the surface of the substrate.
2 more elements
A method of processing a substrate, comprising:
- laterally moving the substrate adjacent a gas distribution plate having a plurality of elongate gas ports, the plurality of elongate gas ports consisting essentially of, in order, a leading first precursor gas port, a second precursor gas port and a trailing first precursor gas port;
- sequentially contacting a surface of the substrate to, in order, a first precursor gas stream from the leading first precursor gas port, a second precursor gas stream from the second precursor gas port and a first precursor gas stream from the trailing first precursor gas port;
- and
- exciting a gaseous species in one or more of the first precursor gas and the second precursor gas before contacting the surface of the substrate by powering a wire positioned within either both the leading and trailing first precursor gas port or the second precursor gas port.
1 more element
Dependencies are inferred from the claim text.