Multilayer stacked circuit arrangement with localized separation section

A multilayer stacked circuit arrangement, comprising:

• a first flat cable, which extends in an extension direction and forms at least one first separation section, at least one first non-separation section, and an extension section, at least one non-separation section being formed between the separation section and the extension section;
• a plurality of conductive terminals, which is arranged in the extension section of the first flat cable;
• a plurality of first signal transmission lines, which is formed on the first flat cable;
• at least one second flat cable, which extends in the extension direction and forms at least one second separation section and at least one second non-separation section, the second separation section and the second non-separation section of the second flat cable being respectively stacked on the first separation section and the first non-separation section of the first flat cable in a direction substantially perpendicular to the extension direction;
• a bonding substance layer, which is formed between the first non-separation section of the first flat cable and the second non-separation section of the second flat cable to bond and position the first flat cable and the second flat cable in a stacked fashion in such a way that the first separation section of the first flat cable and the second separation section of the second flat cable are spaced from each other;
• a plurality of second signal transmission lines, which is formed on the second flat cable;
• and
• at least one conductive via, which extends between the first non-separation section of the first flat cable and the second non-separation section of the second flat cable, at least one of the second signal transmission lines of the second flat cable being connected through the conductive via to the first signal transmission lines of the first flat cable.