Processing apparatus
AssigneeTokyo Electron Limited
InventorsMikio Nakashima, Hiroaki Inadomi, Satoshi Okamura
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AssigneeTokyo Electron Limited
InventorsMikio Nakashima, Hiroaki Inadomi, Satoshi Okamura
Estimating the term…
Provided is a processing apparatus for performing a processing of a substrate to be processed using a high-pressure fluid to prevent the generation of particles and ensure airtightness in the processing container. A sealing member is installed to surround a carrying port of the processing chamber, the carrying port is closed by the cover, and the cover is restricted from retreating by the pressure in the processing chamber by a lock plate, thereby processing the wafer in the processing chamber using the high-pressure fluid. Since the sealing member is pressurized by the internal atmosphere of the processing chamber to be pressed toward the cover during the drying process, a gap between the cover and the processing chamber may be airtightly closed. Since the sealing member does not slide with respect to the processing chamber or the cover, the generation of particles is suppressed.
A processing apparatus comprising:
A processing apparatus comprising:
A processing apparatus comprising:
Dependencies are inferred from the claim text.