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US 2012/0222842 A1Published application
Heat dissipation module
OwnerChih-Jen CHOUinventor
Life of this patent
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Abstract
A heat dissipation module, which comprises a heat dissipation piece, a fan, a heat conduction coating material and a heat conduction piece, is disclosed. The heat conduction coating material is used for improving the thermal radiation coefficient of the heat dissipation piece. Accordingly, when elements transmit heat to the heat dissipation piece via the heat conduction piece, more heat is transmitted to the air via thermal radiation manner. Next, the fan sucks heated air to achieve the effect of heat dissipation.
Claims12
A heat dissipation module comprising:
- a heat dissipation piece;
- a heat conduction piece located on a surface of the heat dissipation piece, wherein a heating element is disposed on the heat conduction piece;
- a heat conduction coating material formed on the heat dissipation piece to improve a thermal radiation coefficient of the heat dissipation piece;
- and
- a fan disposed to a side of the heat dissipation piece to suck the air to dissipate heat generated by the heating element.
2 more elements
Dependencies are inferred from the claim text.