Heat dissipation device
AssigneeFoxconn Technology Co., Ltd.
InventorNIEN-TIEN CHENG
Life of this patent
Estimating the term…
Abstract
An exemplary heat dissipation device for a portable electronic device includes a heat pipe and a heat dissipating member. The heat pipe includes an evaporator section and a condenser section. The evaporator section is attached to a heat source of the portable electronic device. The heat dissipating member includes a sheath, and a porous heat dissipating layer and a working fluid contained in the sheath. The porous heat dissipating layer defines gaps therein. The working fluid is filled in the gaps. The condenser section of the heat pipe is received in the porous heat dissipating layer and thermally contacts the porous heat dissipating layer.
Claims18
A heat dissipation device adapted for a portable electronic device, the heat dissipation device comprising:
- a heat pipe comprising an evaporator section and a condenser section, the evaporator section being configured for thermally attaching to a heat source of the portable electronic device;
- and
- a heat dissipating member comprising a sheath, and a porous heat dissipating layer and a working fluid contained in the sheath, the porous heat dissipating layer defining a plurality of gaps therein, the working fluid filled in the gaps, the condenser section of the heat pipe being received in the porous heat dissipating layer and thermally contacting the porous heat dissipating layer.
A heat dissipation device for a portable electronic device, the heat dissipation device comprising:
- a heat pipe comprising an evaporator section and a condenser section, the evaporator section configured for thermally attaching to a heat source of the portable electronic device;
- and
- a heat dissipating member comprising a sheath, a porous heat dissipating layer lining an inner wall of the sheath, and working fluid, the porous heat dissipating layer defining a plurality of gaps therein, the working fluid filled in the gaps, the condenser section of the heat pipe received in and thermally contacting the porous heat dissipating layer.
Dependencies are inferred from the claim text.